Automatic contactless die sorting of components with visual inspection

Levio is a fully automatic contactless sorting machine. Thanks to Touchless Automation contactless handling technology, the machine can manipulate components of any material with a delicacy never reached before.

Levio can handle a wide range of standard inputs and outputs media, which allows it to be integrated into any production flow. The trackability of each component enables to have complete control of the process quality.

An optional ISO 14644 1 Class 6 cleanroom enclosure and Ionizers for ESD protection complete the machine and reach for even higher process quality.

Machine versions

Levio Sorting

Levio sorting is the starting point to introduce contactless manipulation in your process. With fully contactless die ejection capability and the possibiity to manage different output trays, this machine can be easily integrate in your actual process.

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Levio Laser

Levio Laser is an even more precise configuration of Levio, developed to match the needs of laser diode’s producers. Levio Laser is able to do visual inspection of the diode up and down sides and emitting and reflecting facets.

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Machine dimensions

  • Width 1200mm
  • Depth 1150mm
  • Height 1700mm
  • Weight: approx. 900 kg


  • Voltage 220-240 VAC
  • Current 12A max
  • Air pressure 6 Bars max


  • 4’’, 6’’, 8’’, 12’’ input frame
  • 6 waffle trays 4’’
  • 20 waffle trays 2’’
  • 2 Jedec trays


  • 6 waffle/Gel Pak® trays 4’’
  • 20 waffle/Gel Pak® trays 2’’
  • 2 Jedec trays

Die features

  • Min size: 0.5 mm
  • Max size: 10 mm
  • Min thickness: 100 µm
  • Any material