Fully contactless die bonding, from wafer to package

The new generation of Touchless Automation machine is a fully contactless flip chip bonder. For the first time it is possible to completely avoid mechanical contact with the top surface and preserve the quality of the components after front end processing.

The machine is able to pick up the bare die directly from the wafer, while never touching the upper surface. This step is crucial in order to not damage the active area or to reduce the interaction with solder bumps.

High precision, delicate process

The machine is equipped with machine vision systems and a dedicated software that can align the component to the substrate with a precision up to 5 µm. This level of precision, together with a close control on the temperature and force parameters allows to have a very delicate bonding process.

After bonding, the components are then picked and placed into a wide variety of output carriers. All the process has been completed and the delicate area has never been touched.

Specifications

Machine dimensions

  • Width 1200mm
  • Depth 1150mm
  • Height 1700mm
  • Weight: approx. 900 kg

Requirements

  • Voltage 220-240 VAC
  • Current 12A max
  • Air pressure 6 Bars max

Input

  • 4’’, 6’’, 8’’, 12’’ input frame
  • 6 waffle trays 4’’
  • 20 waffle trays 2’’
  • 2 Jedec trays

Die features

  • Min size: 0.5 mm
  • Max size: 10 mm
  • Min thickness: 100 µm
  • Any material

Technologies

  • Thermocompression bonding
  • Thermo-ultrasonic bonding

Process parameters

  • Precision: 5 µm
  • Temperature: 0 – 350° C
  • Force: 0.05 – 5 kg