Flexible, easy to use, menu driven software, advanced mechanic and electronic characteristics, fully contactless manipulation capabilities.
These features and many more make our dedicated world premiere contacless process pick & place system a perfect choice for your needs.
High technology, innovation and reliability meet to serve your needs.

Developed together with Aatec, this machine sums up the expertise of the two companies to create something unique.

Levio – Automatic contactless handling

Base equipment:

  • Welded Frame/Base plate with safety protection and electronic cabinet
  • Doors on both side
  • Touch screen HMI
  • Die ejection module with xy dynamic
  • Contactless pick up head
  • High precision motion control & positioning
  • CE Marking
  • UPH: 1000-1500 parts/hour according to configuration

Dimensions and requirements:

  • Voltage 220-240 VAC / 12A Max
  • Air pressure 6 Bars max.
  • Weight: 600 kg
  • Dimensions:
    • L = 1700mm
    • W = 1100mm
    • H = 1700mm

Components

  • Any size from 0.5×0.5mm to 10x10mm
  • Any material (GaAs, GaN, Glass, Plastic, …)
  • Delicate surfaces and MEMS

Features

  • Inputs:
    • Wafer from 4 to 12 inches
    • Up to 6 waffle trays 4 inches
    • Up to 20 waffle trays 2 inches
    • 2 Jedec trays
  • Outputs:
    • Up to 6 waffle/Gel Pak trays 4 inches
    • Up to 20 waffle/Gel Pak trays 2 inches
    • 2 Jedec trays
    • Tape & Reel module (optional)
  • Flip module (optional)
  • Vision inspection module (top/bottom)